via TechSpot https://ift.tt/YDUQgPa
Liquid nitrogen is widely used throughout the semiconductor manufacturing process to remove heat and create inert environments in critical process areas. However, when brought to the boiling point, which is 77 Kelvin or -196 °C, it can no longer be used in certain applications because the current generation of nanosheet...
Read Entire Article
Liquid nitrogen is widely used throughout the semiconductor manufacturing process to remove heat and create inert environments in critical process areas. However, when brought to the boiling point, which is 77 Kelvin or -196 °C, it can no longer be used in certain applications because the current generation of nanosheet...
Read Entire Article
Comments
Post a Comment